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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com 09.dec.2015 rev.001 motor drivers for digital still cameras 7-c hannel system lens driver for digital still cameras BD6889GU general description the BD6889GU is a motor driver that integrates 6 f ull - on type h-bridges and 1 linear constant-current type h-bridge . the device is intended to drive three stepping motor for auto focus system, zoom, and iris, and making it possible to design a sophisticated, high precision lens drive system. features ? low on-resistance power cmos output ? 4 d igi tal npn transistor circuits for rectangular waveform of photo-interrupter: input-dividing type with output pull-up resistor ? 4 digital pnp transistor circuits for rectangular waveform of photo-interrupter: input-dividing type with output p ull -down resistor ? voltage-regulator circuit for photo-interrupter ? h igh -precision (0.9v2%) reference voltage output ? phase compensation capacitor-free design for linear constant-current drive block ? h igh -precision (3%) linear constant-current driver ? under voltage locked out protection & thermal shut down circ ui t applications ? mobile system ? home appliance ? amusement system, etc key specifications ? power supply voltage range: 2.5v to 5.7v ? motor power supply voltage r ange: 2.5v to 5.7v ? circuit current (no signal): 1.5ma(typ) ? stand-by current: 10 a (max) ? control input voltage range: 0v to v cc v ? h-bridge output current: -0.5a/ch to +0.5a/ch ? output on-resistance (c hannel 1 to 6 ): 1.3 (typ) ? output on-resistance (c hannel 7 ): 0.9 (typ) ? operating temperature range: - 25 c to +85c package w(typ) x d(typ) x h(max) vb ga063t050 5.00mm x 5.00mm x 1. 20 mm vbga063t050 datashee t datashee t downloaded from: http:///
2/ 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 r 2 vm4 out6a out 6b ps out1a out1b out2a out2b h bridge full on h bridge full on m in1a bandgap tsd & uvlo c7 h2 h3 h7 h6 vm1 h5 pgnd1 h4 out3a out3b out4a out4b h bridge full on h bridge full on m g8 f8 b8 c8 d8 pgnd2 e8 vm2 in1b e3 e4 in2a in2b f3 g3 in3b f6 f7 in4a in4b e6 e5 in3a bypass filter capacitor for power supply bypass filter capacitor for power supply power saving h :active l : stand- by motor control input motor control input bypass filter capacitor for power supply rnf 0.1 to 5.0 out7a out7b h bridge const. current c1 g1 e1 in7a c4 in7b d4 sense f1 g2 motor control input when using the vref voltage (0.9v) resistor division value as vlim input value, select r1 and r2 values, as follows 1k r 1 +r 2 20k power save out5a out5b h bridge full on h bridge full on m a7 a6 a2 a3 a4 pgnd3 a5 vm3 in5b c6 d5 in6a in6b b3 b4 in5a bypass filter capacitor for power supply motor control input d1 gnd the sensor signal si2, for lens position detection, is reshaped and output to so2x vcc 1 f to 100 f d2 bypass filter capacitor for power supply level shift & pre driver level shift & pre driver level shift & pre driver the motor output current is converted to a voltage with the external rnf resistor and transmitted to the sense pin. i out [a] = v v lim [v]r r nf [] vlim f2 vref vref d3 r 1 vcc vcc vcc sw sw so1n f4 so1p g4 g5 si1 vcc vcc vcc sw sw so2n f5 so2p g6 g7 si2 vcc vcc vcc sw sw so3n d6 so3p d7 e7 si3 vcc vcc vcc sw sw so4p b5 so4n b6 si4 c5 reg reg reg reg level shift & pre driver vcc sw c2 reg b7 dsel1 dsel2 e2 c3 b2 dsw dtr selector digital transistor sw selector for digital transistor reg switch h : reg on l : reg off power supply for photo interrupter the sensor signal si1, for lens position detection, is reshaped and output to so1x the sensor signal si3, for lens position detection, is reshaped and output to so3x logic7 logic 56 logic 34 logic 12 1 f to 100 f 1 f to 100 f 1 f to 100 f 1 f to 100 f typical application circuit the sensor signal si4, for lens position detection, is reshaped and output to so4x downloaded from: http:///
3/ 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 pin configurations pin descriptions 1 2 3 4 5 6 7 8 a n.c. out6a out6b vm3 pgnd3 out5b out5a n.c. b index post dsw in6a in6b so4p so4n reg out4a c out7a sw dsel2 in7a si4 in5a ps out4b d vm4 vcc vref in7b in5b si3 so3p vm2 e rnf dsel1 in1a in1b in4b in4a so3n pgnd2 f sense vlim in2a si1 si2 in3a in3b out3b g out7b gnd in2b so1p so1n so2p so2n out3a h n.c. out1a out1b pgn d1 vm1 out2b out2a n.c. pin no. pin name function pin no. pin name function a1 n.c. - e1 rnf current detect resistor ch .7 a2 out6a h-bridge output 6a e2 dsel1 selector for transistor output 1 a3 out6b h-bridge output 6b e3 in1a control logic input 1a a4 vm3 motor power supply ch .5, ch.6 e4 in1b control logic input 1b a5 pgnd3 motor ground ch.5, ch .6 e5 in4b control logic input 4b a6 out5b h-bridge output 5b e6 in4a control logic input 4a a7 out5a h-bridge output 5a e7 so3n npn transistor output 3 a8 n.c. - e8 pgnd2 motor ground ch.3 & ch .4 b1 index post f1 sense output current detection ch .7 b2 dsw enable for transistors f2 vlim output current setting ch.7 b3 in6a control logic input 6a f3 in2a control logi c input 2a b4 in6b control logic input 6b f4 si1 digital transistor input 1 b5 so4p pnp transistor output 4 f5 si2 digital transistor input 2 b6 so4n npn transistor output 4 f6 in3a control logic input 3a b7 reg regulator output for pi f7 in3b control logic input 3b b8 out4a h-bridge output 4a f8 out3b h-bridge output 3b c1 out7a h-bridge output 7a g1 out7b h-bridge output 7b c2 sw regulator input g2 gnd device ground c3 dsel2 selector for transistor output 2 g3 in2b control logic input 2b c4 in7a control logic input 7a g4 so1p pnp transistor output 1 c5 si4 digital transistor input 4 g5 so1n npn transistor output 1 c6 in5a control logic input 5a g6 so2p pnp transistor output 2 c7 ps power-saving g7 so2n npn transistor output 2 c8 out4b h-bridge output 4b g8 out3a h-bridge output 3a d1 vm4 motor power supply ch.7 h1 n.c. - d2 vcc power supply h2 out1a h-bridge output 1a d3 vref reference voltage output h3 out1b h-bridge output 1b d4 in7b control logic input 7b h4 pgnd1 motor ground ch.1, ch .2 d5 in5b control logic input 5b h5 vm1 mo tor power supply ch.1, ch.2 d6 si3 digital transistor input 3 h6 out2b h-bridge output 2b d7 so3p pnp transistor output 3 h7 out2a h-bridge output 2a d8 vm2 motor power supply ch .3, ch.4 h8 n.c. - (top view) downloaded from: http:///
4/ 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 block diagr am vm4 out6a out6b ps out1a out1b out2a out2b h bridge full on h bridge full on in1a bandgap tsd & uvlo c7 h2 h3 h7 h6 vm1 h5 pgnd1 h4 out3a out3b out4a out4b h bridge full on h bridge full on g8 f8 b8 c8 d8 pgnd2 e8 vm2 in1b e3 e4 in 2a in2b f3 g3 in3b f6 f7 in4a in4b e6 e5 in3a rnf out7a out7b h bridge const. current c1 g1 e1 in7a c4 in7b d4 sense f1 g2 power save out5a out5b h bridge full on h bridge full on a7 a6 a2 a3 a4 pgnd3 a5 vm3 in5b c6 d5 in6a in6b b3 b4 in5a d1 gnd vcc d2 level shift & pre driver level shift & pre driver level shift & pre driver vlim f2 vref vref d3 vcc vcc vcc sw sw so1n f4 so1p g4 g5 si1 vcc vcc vcc sw sw so2n f5 so2p g6 g7 si2 vcc vcc vcc sw sw so3n d6 so3p d7 e7 si3 v cc vcc vcc sw sw so4p b5 so4n b6 si4 c5 level shift & pre driver vcc sw c2 reg b7 dsel1 dsel2 e2 c3 b2 dsw dtr selector digital transistor sw logic7 logic 56 logic 34 logic 12 downloaded from: http:///
5/ 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 description of blocks 1. power-saving function a power-saving function is included, which allows the system to save power when not driving the motor. the voltage level on this pin should be set high so as to keep the operation mode. (see the electrical characteris tics; p .7 / 17) 2. motor control input (in1a to in7b) logic level controls the output logic of h-bridge . the logic of full-on h-bridges corresponds to in/in mode, and the logic of constant-current h-bridge en/in mode . (see the electrical characteristics; p.7 /1 7, and i/o truth table; p.9/17) 3. h-bridge each h-bridge can be controlled independently. it is therefo re possible to drive the h-bridges simultaneously, as l ong as the package thermal tolerances are not exceeded. beca use the respective output transistors consist of power cmos which consumes a motor power supply v m , t he on -resistance value of high and low-side total is depend ent on v m voltage. further, t he whole application must be designed so that the maximu m current of each channel may be 500ma or below. (see the recommended operating conditions; p.6 /1 7) 4. lin ear constant-current h-bridge (channel 7) (a) reference voltage output (with a tolerance of ? 2%) the vref pin can output 0.9v based on the internal reference volta ge . the output current of the constant-current drive block can be controlled by connecting extern al resist or to the vref pin and setting the voltage which is divided by the resistor to the output current s etting pin (vlim pin). it is recommended to place the external 1 k or above resistor in consideration of the load current capacity o f the vref pin, and to place the 20k or below resistor in order to minimize the fluctuation caus ed by the base current of the internal transistor . (b) output current detection and current settings a low-value ( 0.1 to 5.0 ) resistor can be placed between the rnf pin and ground to detect the motor winding current. when making the rnf and sense pins short-circuit, the interna l circuits can output the accurate constant current by comparing the vlim voltage with detecting vo ltage. to make more accurate motor winding current, trim the external rnf resist or , and supply vlim pin with another precise external voltage. in case of this condition, vref pin should be kept open. output current i out [a] = vlim[v] / rnf[ ] the motor winding current will be 400ma ? 3% , if 0.2v is set to the vlim pin and a 0.5 external resistor is connected to the rnf pin. if the vlim pin is shorted to the vcc pin (or the same voltage as the v cc is set) and the sense and rnf pins are shorted to the ground, this channel can driv e as a full-on type h-bridge like other channels. 5. digital transistor for rectangular waveform the internal 4 npn and 4 pnp digital transistors can be used to make photo -interrupter waveform rectangular . to detect lens position, the sensed signal is reshaped by internal circuitry and then may be output to the mcu etc . the device includes pull-up resistors for each npn output pin (so1n to so4n) and pull-down resistors for each pnp output pin (so1p to so4p). if not supplying an external voltage to i nput pins (si1 to si4), the npn output pins will output v cc voltage and the pnp output pins ground . dsw, dsel1 and dsel2 pins can control the switching of npn and pnp transistors . ( see i/o truth table; p.9/1 7) 6. voltage-regulator for photo-interrupter the device includes voltage-regulator circuits for photo-i nterrupter. set high logic on sw pin to enable output of the in ternal regulator, and set low to disable. it also includes a pull-down resistor so that regulator output (reg pin) may be off even if sw pin is opened. downloaded from: http:///
6/ 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 absolute maximum ratings (ta=25c) parameter symbol limit unit power supply voltage v cc - 0. 5 to +7.0 v motor power supply voltage v m - 0. 5 to +7.0 v control input voltage v in - 0. 5 to +v cc +0.5 v power dissipation pd 0.98 (note 1) w h-bridge output current i out -0.8 to +0.8 (note 2) a/ch storage temperature range tstg -55 to +150 c junction temperature tjmax 150 c (note 1) reduced by 7.84mw/c over 25c, when mounted on a glass epo xy board (70mm x 70mm x 1.6mm) (note 2) must not exceed pd, aso, or tjmax of 150c caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol min typ max unit power supply voltage v cc 2.5 - 5. 7 v motor power supply voltage v m 2.5 - 5.7 v control input voltage v in 0 - v cc v h-bridge output current (note 3) i out -0.5 - +0.5 a/ch operating temperature range topr - 25 - +85 c (note 3) must not exceed pd, aso, or tjmax of 150c downloaded from: http:///
7/ 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 electrical characteristics (unless otherwise specified v cc =3 .0v , v m =5.0v , ta=25c) parameter symbol min typ max unit conditions all circuits stand- by current i ccst - 0 10 a v ps =0v circuit current i cc - 1.5 3.0 ma v ps =3v, with no signal control input (in=ps, in1a to in7b, sw, dsw, dsel1, dsel2) high level input voltage v inh 2.0 - v cc v low level input voltage v inl 0 - 0.7 v high level input current i inh 15 30 60 a v in =3v low level input current i inl -1 0 - a v in =0v pull-down resistor r in 50 100 200 k under voltage locked out (uvlo) uvlo voltage v uvlo 1.6 - 2.4 v full-on drive block (c hannel 1 to channel 6) output on-resistance r on - 1.3 1.6 i out =400ma, high & low-side total pulse input response t p 100 - - ns with an input pulse 200ns linear constant-current drive block (channel 7) output on-resistance r on - 0.9 1.1 i out =400ma, high & low-side total vref output voltage v ref 0.88 0.90 0.92 v i out =0 to 1ma output limit current 1 i ol1 388 400 412 ma 10 load, r rnf =0.5 , v vlim =0.20v output limit current 2 i ol2 285 300 315 ma 10 load, r rnf =0.5 , v vlim =0.15v output limit current 3 i ol3 190 200 210 ma 10 load, r rnf =0.5 , v vlim =0.10v digital npn transistor block for rectangular waveform of photo-interrupte r input current i sih - - 0.1 ma v six =3v low level output voltage v sol - 0.1 0.25 v v si x =3v, i so =0.5ma input dividing resist or r sin 70 100 130 k output pull-up resist or r soh 23 33 43 k input di viding resistors comparison - 0.8 1.0 1.2 - comparison of dividing resistors between six and gnd (note 4) digital pnp transistor block for rectangular waveform of photo-interrupte r input current i sil -0.1 - - ma v six =0v high level output voltage v soh v cc -0.25 v cc -0.1 - v v six =0v, i so =-0.5ma input dividing resist or r sip 70 100 130 k output pull-down resist or r sol 23 33 43 k input dividing resistors comparison - 0.8 1.0 1.2 - comparison of dividing resistors between six and vcc (note 4) voltage-regulator for photo-interrupter high level output voltage v regh v cc -0.25 v cc -0.2 - v i reg =100ma output on-resistance r onreg - 2 2.5 i reg =100ma output leak current i lpi - 0 1 a sw=vcc (note 4) not guaranteed by testing downloaded from: http:///
8/ 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 typical performance curves figure 1. circuit current vs power supply voltage figure 2. output on-resistance vs motor power supply voltage (channel 1 to channel 6 , v cc =3v) figure 3. output on -resistance vs motor power supply voltage (channel 7, v cc =3v) figure 4. rnf voltage vs vlim voltage (output limit voltage , r rnf =0.5 ) 0.0 1.0 2.0 3.0 4.0 5.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 power supply voltage : v cc [v] circuit current : i cc [ma] top 85c mid 25c low - 25 c operating range (2.5v to 5.7v) 0.0 1.0 2.0 3.0 4.0 5.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 motor power supply voltage : v m [v] output on resistance : r on [] top 85c mid 25c low - 25 c operating range (2.5v to 5.7v) 0.0 1.0 2.0 3.0 4.0 5.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 motor power supply voltage : v m [v] output on resistance : r on [] top 85c mid 25c low - 25 c operating range (2.5v to 5.7v) 0 50 100 150 200 250 0 50 100 150 200 250 vlim voltage : v m [v] rnf voltage : v rnf [v] top 85c mid 25c low - 25 c downloaded from: http:///
9/ 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 timing chart table 1. i/o truth table (c hannel 1 to channel 6) input mode input output inxa inxb outxa outxb output mode (note 5) in/in l l z z open h l h l cw l h l h ccw h h l l short brake l: low, h: high, x: don t care, z: hi impedance (note 5) cw : current flows from outxa to outxb, ccw: current flows from outxb to outxa (x=1 to 6) table 2. i/o truth table (c hannel 7) input mode input output in7a in7b out7a out7b output mode (note 6) en/in l x z z open h l h l cw h h l h ccw l: low, h: high, x: don t care, z: hi impedance (note 6) cw : current flows from out7a to out7b, ccw: current flows from out7b t o out7a table 3. digital transistor i/o truth table input output dsw dsel1 dsel2 pnp1 npn1 pnp2 npn2 pnp3 npn3 pnp4 npn4 logic l x x off off off off off off off off h l l off on off on off on off on h l h off on off on on off on off h h l on off on off off on off on h h h on off on off on off on off l: low, h: high, x: don t care, off: gnd (pnp), vcc (npn) pnpx can output to soxp pins, npnx can output to soxn pins (x=1 to 4) downloaded from: http:///
10 / 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 timing chart C continued table 4. i/o truth table (in the case of 2phases driving the stepping motor by ch annel 1 and channel 2) input output in1a in1b in2a in2b out1a out1b out2a out2b output mode (note 7) l l l l z z z z open h l h l h l h l 1. cw / cw l h h l l h h l 3. ccw / cw l h l h l h l h 5. ccw / ccw h l l h h l l h 7. cw / ccw l: low, h: high, x: don t care, z: hi impedance (note 7) cw : current flows from outxa to outxb, ccw: current flows from outxb to outxa (x=1, 2) table 5. i/o truth table (in the case of 1-2 phases driving t he stepping motor by ch annel 1 and channel 2) input output in1a in1b in2a in2b out1a out1b out2a out2b ` (note 8) l l l l z z z z open / open h l h l h l h l 1. cw / cw l l h l z z h l 2. open / cw l h h l l h h l 3. ccw / cw l h l l l h z z 4. ccw / open l h l h l h l h 5. ccw / ccw l l l h z z l h 6. open / ccw h l l h h l l h 7. cw / ccw h l l l h l z z 8. cw / open l: low, h: high, x: don t care, z: hi impedance (note 8) cw : current flows from outxa to outxb, ccw: current flows from outxb to outxa (x=1, 2) figure 5 . figure 6. 2 phases timing sequence with in/in input 1-2 phases t iming sequence with in/in input h l h l h l h l h l h l h l h l in1a in1b in2a in2b out 1a out1b out2a out2b 1 3 5 7 1 3 5 7 high impedance h l h l h l h l h l h l h l h l in1a in1b in2a in2b out1a out1b out2a out2b 1 2 3 4 5 6 7 8 figure 7. torque vector of 2 phases mode out1a cw out1b ccw out2b ccw cw ou t2a 1 5 7 3 forward reverse figure 8. torque vector of 1-2 phases mode out1a cw out1b ccw out2b ccw cw out2a 1 5 7 3 forward reverse 2 6 4 8 downloaded from: http:///
11 / 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 r 2 vm4 out6a out6b ps out1a out1b out2a out2b h bridge full on h bridge full on m in1a bandgap tsd & uvlo c7 h2 h3 h7 h6 vm1 h5 pgnd1 h4 out3a out3b out4a out4b h bridge full on h bridge full on m g8 f8 b8 c8 d8 pgnd2 e8 vm2 in1b e3 e4 in2a in2b f3 g3 in3b f6 f7 in4a in4b e6 e5 in3a bypass filter capacitor for power supply bypass filter capacitor for power supply power saving h :active l : stand- by motor control input motor control input bypass filter capacitor for power supply rnf 0.1 to 5.0 out7a out7b h bridge const. current c1 g1 e1 in7a c4 in7b d4 sense f1 g2 motor control input when using the vref voltage (0.9v) resistor division value as vlim input value, select r1 and r2 values, as follows 1k r 1 +r 2 20k power save out5a out5b h bridge full on h bridge full on m a7 a6 a2 a3 a4 pgnd3 a5 vm3 in5b c6 d5 in6a in6b b3 b4 in5a bypass filter capacitor for power supply motor control input d1 gnd the sensor signal si2, for lens position detection, is reshaped and output to so2x vcc 1 f to 100 f d2 bypass filter capacitor for power supply level shift & pre driver level shift & pre driver level shift & pre driver the motor output current is converted to a voltage with the external rnf resistor and transmitted to the sense pin. i out [a] = v v lim [v]r r nf [] vlim f2 vref vref d3 r 1 vcc vcc vcc sw sw so1n f4 so1p g4 g5 si1 vcc vcc vcc sw sw so2n f5 so2p g6 g7 si2 vcc vcc vcc sw sw so3n d6 so3p d7 e7 si3 vcc vcc vcc sw sw so4p b5 so4n b6 si4 c5 reg reg reg reg level shift & pre driver vcc sw c2 reg b7 dsel1 dsel2 e2 c3 b2 dsw dtr selector digital transistor sw selector for digital transistor reg switch h : reg on l : reg off power supply for photo interrupter the sensor signal si1, for lens position detection, is reshaped and output to so1x the sensor signal si3, for lens position detection, is reshaped and output to so3x logic7 logic 56 logic 34 logic 12 1 f to 100 f 1 f to 100 f 1 f to 100 f 1 f to 100 f application example selection of components externally connected when using the circuit with changes to the external circu it constants, make sure to leave an adequate margin for e xternal components including static and transitional characteristics as well as dispersion of the ic. the sensor signal si4, for lens position detection, is reshaped and output to so4x downloaded from: http:///
12 / 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 power dissipation figure 9 . power dissipation vs ambient temperature i/o equivalent circuits ps, in1a to in7b, sw, dsw, dsel1, dsel2 vmx, outxa, outxb, pgndx, rnf vref si1 to si4 vlim, sense reg so1n to so4n so1p to so4p 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature : ta [c] power dissipation : pd [w] 0.98 w 0.51 w 85 c pgndx rnf outxa vmx outxb vcc 10k vcc 100k vcc vcc 100k vcc 1k vcc vcc 33k vcc vcc 33k vcc vcc 100k 100k 100k 100k vcc vcc downloaded from: http:///
13 / 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. gr ound wiring pattern when using both small-signal(gnd) and large-current groun d(pgnd) traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the sma ll -signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground line s must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding th is absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each proc ess or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos trans istor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
14 / 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 10. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ratin g is exceeded for a continued per iod, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
15 / 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 ordering information b d 6 8 8 9 g u - e 2 part number package gu: vbga063t050 packaging and forming specification e2: embossed tape and reel marking diagram part number marking package orderable part number bd6889 vbga063t050 BD6889GU- e2 vbga0 63 t050 (top view) bd6889 part number marking lot number 1pin mark downloaded from: http:///
16 / 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 physical dimension tape and reel information package name vbga063t050 downloaded from: http:///
17 / 17 tsz02201-0h3h0b601390-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BD6889GU 09.dec.2015 rev.001 revision history date revision changes 09.dec.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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